Qianli BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Tin Planting Soldering Template Solder Net

  • $3.20
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Frais de port calculés à l'étape de paiement.

Qianli BGA Reballing Stencil Kit for iPhone 13 12 11 Pro Max XR XS X 8 7 6S 6 Motherboard IC Chip CPU Soldering Net

--High Quality Steel Reballing Stencil.
--Specially Designed for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR.
--Specially Designed for iPhone 11/11Pro/11Pro Max/12/12Pro/12Pro Max/12Mini/13/13Pro/13Pro Max.
--Material : High Quality Steel.
--Feature : Square Hole Design, Precise Position, High Temperature Resistance.
--We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.

Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.

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