MECHANIC Heat Kit Smart Reflow Soldering Heating Platform

  • $169.00
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Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform With Stencil For iPhone 11-13Pro Max Motherboard Layered Welding

 

Features:

 

  • Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation

 

  • Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow

 

  • The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance

 

  • 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily

 

  • 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode

 

  • Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat

 

  • Monitor temperature changes and realize reflow soldering temperature curve data monitoring

 

  • Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view

 

  • Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max


Key Description:

 

  • "Add button" click to adjust the temperature, long press to start heating

 

  • "Minus key" click to adjust the temperature, long press to start cooling

 

  • "MEM key" click to switch three temperature memory, long press to set the memory temperature

 

  • "SET button" click to switch five modes, long press to set the mode temperature


Package includes:

 

  • 1 x Host

 

  • 1 x Power Cord

 

  • 6 x Modules

 

  • 12 x Steel mesh

 

 


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