MECHANIC Heat Kit Smart Reflow Soldering Heating Platform

  • $169.00
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Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform With Stencil For iPhone 11-13Pro Max Motherboard Layered Welding




  • Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation


  • Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow


  • The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance


  • 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily


  • 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode


  • Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat


  • Monitor temperature changes and realize reflow soldering temperature curve data monitoring


  • Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view


  • Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max

Key Description:


  • "Add button" click to adjust the temperature, long press to start heating


  • "Minus key" click to adjust the temperature, long press to start cooling


  • "MEM key" click to switch three temperature memory, long press to set the memory temperature


  • "SET button" click to switch five modes, long press to set the mode temperature

Package includes:


  • 1 x Host


  • 1 x Power Cord


  • 6 x Modules


  • 12 x Steel mesh



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